Xiguang Display
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COB is a packaging method where multiple LED chips (the red, green, and blue diodes that make a pixel) are directly bonded to a substrate (the circuit board) and then encapsulated as a single, unified module with a protective phosphor coating.
(Product Demonstration Video)
No Dead Pixels: The epoxy resin coating fully protects the LED chips from moisture, dust, oxygen, and static electricity. With COB, the entire module is protected, making pixel failures extremely rare.
High Impact and Scratch Resistance: The surface is a solid, smooth layer. It can withstand direct poking, scraping, and light impacts. Ideal for public spaces and interactive kiosks.
Longer Lifespan: Superior protection and efficient heat dissipation significantly reduce the degradation rate of the LED chips.
Direct Heat Path: Since the LED chips are bonded directly to the PCB, heat is conducted away more efficiently. The PCB itself acts as a large heatsink, resulting in a lower operating temperature and preventing color shift.
| Model | A60 COB |
| Pixel Pitch | P0.6/ P0.9 / 1.25 / P1.5 / P1.8 |
| Color Configuration | 1R1G1B Flip chip |
| Module Size | 150x168.75mm |
| Cabinet Size | 600x337.5mm |
| Brightness | 600-800 Nits |
| Viewing Angle | H: 140°; V:140° |
| Refresh Rate | 3840Hz |
| Life Span | 100,000 Hours |
Applications: Suitable for Churches, Cinema Theaters, Retail stores, Government conferences, and Entertainment venues.
Certifications: CE, ROHS, FCC, CB, PSE, ETL, ISO9001, ISO14001, ISO45001.
