Xiguang Display
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Wire bonding is a sophisticated technique used in COB (Chip-on-Board) LED module displays. Multiple LED chips are directly mounted on a PCB without individual packages, ensuring extremely reliable electrical connections via thin gold, aluminum, or copper wires.
Ideal for space-limited applications with its streamlined structure.
Enables more chips per board for superior pixel density and image quality.
Advanced thermal management ensures longevity and operational reliability.
Lower power consumption reduces long-term operational costs.
Provides clear visibility from various positions and extreme angles.
Strong resistance to shocks, vibrations, and environmental factors.
| Items | P0.93 | P1.25 | P1.56 |
|---|---|---|---|
| Module size | 150*168.75mm | ||
| Lamp resolution | 160*180 | 120*135 | 96*108 |
| Scan | 54S | 60S | 54S |
| Surface Hardness | 4H | ||
| Pixel Density | 1,137,777 points | 640,000 points | 409,600 points |
| Refresh Rate | 3840Hz | ||
| Contrast Ratio | 10000:1 | ||
| Maintenance | Front service | ||
| LED Life | 100,000 hours | ||
With over 5 years of specialized experience in high-quality indoor & outdoor LED display products, we are committed to efficiency and integrity. Our products adhere to ISO9001:2015 quality system standards and are exported to over 70 countries.
