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| Customization: | Available |
|---|---|
| Tube Chip Color: | Full Color |
| Display Function: | Video Display, Image & Text Display, Text Display, Market Display |
What is COB Package technology?
COB package (Chips on Board) is a technology designed to solve LED heat dissipation issues. Compared with SMD, it saves space, simplifies packaging, and provides efficient thermal management. The bare chip is bonded directly to the substrate and encapsulated with glue for superior protection.


| Light Chip & Module Details | |
|---|---|
| Type | SMD1010 / Nationstar |
| Color | 1R1G1B |
| Module Size | 150mm(W) x 56.25mm(H) |
| Refresh Rate | ≥2000Hz |
| Viewing Angle | Horizontal 170°, Vertical 170° |
| Contrast Ratio | 10000:1 |
| Brightness | ≥50 - 600 nits |
| Power Consumption | Max 800 w/m2 (Average 300 w/m2) |





Xiguang Display