Xiguang Display
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Wire bonding is a critical technique used in the assembly of COB (Chip-on-Board) LED module displays. By mounting multiple LED chips directly onto a PCB, this technology achieves superior performance without individual packages. Utilizing extremely thin gold, aluminum, or copper wires, these chips are bonded precisely to ensure maximum reliability and visual quality.
Enables more LED chips per square inch, resulting in higher pixel density and breathtaking image clarity for space-limited applications.
Designed for longevity, the COB structure offers significantly better cooling compared to traditional LED designs.
Maintains consistent color and brightness from nearly any position, perfect for large-scale audience engagement.
Lower power consumption combined with high-durability resistance to environmental factors like shocks and vibrations.
| Items | P0.93 | P1.25 | P1.56 |
|---|---|---|---|
| Module size | 150*168.75mm | ||
| Lamp resolution | 160*180 | 120*135 | 96*108 |
| Scan Number | 54S | 60S | 54S |
| Surface Hardness | 4H | ||
| Refresh Rate | 3840Hz | ||
| Contrast Ratio | 10000:1 | ||
| Brightness | 600 cd / m² | ||
| Viewing Angle | 160° | ||
Our focus is on developing and manufacturing high-quality indoor and outdoor LED display products. With over 8 years of industry experience, we ensure international quality standards through strict adherence to the ISO9001:2015 system. Our products are widely used in over 70 countries, backed by certifications like CE, FCC, CCC, and ROHS.
Expert technical advice, assistance with budget-friendly selections, technical drawings, and custom software solutions.
Warranty service exceeding two years, free remote maintenance, troubleshooting, and lifetime follow-up services.
